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Copper No. C10100

Oxygen Free High Conductivity Copper

UNS CDA 101 , ASTM B 187 , ASTM B 152

Nominal Chemical Composition % by weight

Copper Residual Deoxidants Phosphorus Tellurium
99.99 - .0003 max .0010 max

Material Properties

High thermal and electrical conductivity and high ductility combined with low volatility makes this material indispensable in the electronics industry.

Applications

Some typical uses for Copper Alloy 10100 in the electrical and electronic industries are bus bars, bus conductors, wave guides, hollow conductors, lead-in wires and anodes for vacuum tubes, glass to metal seals and others.

Mechanical Properties 

Typical for 1" solid diameter Hard (35%) Temper

Hardness* Rockwell F Scales 87
Tensile Strength** KSI 48
Yield Strength** KSI 44
Elongation** % in 2 inch 16

*Hardness conversions are approximate

**Test values are nominal approximations and depend on specimen size and orientation.

Physical Properties

Thermal Conductivity BTU/ (sq ft-ft-hr-F) 226
Specific Heat BTU/lb/F @ 68F .092
Thermal Expansion Per F from 68 F to 212 F .0000094
Density lb/cu in @ 68 F .323
Electrical Conductivity % IACS @ 68 F 101
Modulus of Elasticity KSI 17,000

Fabrication Properties

Capacity for being cold worked Excellent
Capacity for being hot formed Excellent
Hot forgeability rating (forging brass=100) 65
Hot working temperature 1400-1600 F or 750-875 C
Annealing temperature 700-1200 F or 375-650 C
Machinability rating (Free Cutting Brass=100) 20
Suitability for being joined by: Soldering/Excellent
Brazing/Good
Oxyacetylene Welding/Not Recommended
Gas Shielded Arc Welding/Fair
Coated Metal Arc Welding/Not Recommended
Resistance Welding Spot/Not Recommended
Seam/Not Recommended
Butt/Good

The values listed above represent reasonable approximations suitable for general engineering use. Due to commercial variations in composition and to manufacturing limitations, they should not be used for specification purposes. See applicable A.S.T.M. specification references.