|
|
|
Copper No. C10100
Oxygen Free High Conductivity Copper
UNS CDA 101 , ASTM B 187 , ASTM B 152
Nominal Chemical Composition % by
weight
| Copper |
Residual Deoxidants |
Phosphorus |
Tellurium |
| 99.99 |
- |
.0003 max |
.0010 max |
Material Properties
High thermal and electrical conductivity and high
ductility combined with low volatility makes this material indispensable in
the electronics industry.
Applications
Some typical uses for Copper Alloy 10100 in the electrical
and electronic industries are bus bars, bus conductors, wave guides, hollow
conductors, lead-in wires and anodes for vacuum tubes, glass to metal seals
and others.
Mechanical Properties
Typical for 1" solid diameter Hard
(35%) Temper
| Hardness* |
Rockwell F Scales |
87 |
| Tensile Strength** |
KSI |
48 |
| Yield Strength** |
KSI |
44 |
| Elongation** |
% in 2 inch |
16 |
*Hardness conversions are approximate
**Test values are nominal approximations and depend on specimen
size and orientation.
Physical Properties
| Thermal Conductivity |
BTU/ (sq ft-ft-hr-F) |
226 |
| Specific Heat |
BTU/lb/ºF @ 68F |
.092 |
| Thermal Expansion |
Per °F from 68 F to 212 F |
.0000094 |
| Density |
lb/cu in @ 68 F |
.323 |
| Electrical Conductivity |
% IACS @ 68 F |
101 |
| Modulus of Elasticity |
KSI |
17,000 |
Fabrication Properties
| Capacity for being cold worked |
Excellent |
| Capacity for being hot formed |
Excellent |
| Hot forgeability rating (forging brass=100) |
65 |
| Hot working temperature |
1400-1600 F or 750-875 C |
| Annealing temperature |
700-1200 F or 375-650 C |
| Machinability rating (Free Cutting
Brass=100) |
20 |
| Suitability for being joined by: |
Soldering/Excellent |
|
Brazing/Good |
|
Oxyacetylene Welding/Not Recommended |
|
Gas Shielded Arc Welding/Fair |
|
Coated Metal Arc Welding/Not Recommended |
| Resistance Welding |
Spot/Not Recommended |
|
Seam/Not Recommended |
|
Butt/Good |
The values listed above represent reasonable
approximations suitable for general engineering use. Due to commercial
variations in composition and to manufacturing limitations, they should not
be used for specification purposes. See applicable A.S.T.M. specification
references.
|
