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COPPER ANODES FOR PLATING SILICON WAFERS

Anchor Bronze & Metals provides C12220 phosphorized copper anodes for plating silicon wafers. The anode chemistry is held at .04% - .06% phosphorus suitable for the acid sulfate plating process. Only very pure cathode material is used to produce these anodes. The anode copper is continuously cast to avoid inclusions and cycled through several forging and annealing cycles to reduce the grain size to an average of 120 microns. Copper anodes are available as blanks or finished machined to your specifications.

Typical Chemical Analysis

* ASTM B379, BS 6017, DN EN 1976 (Cu-DXP) andNF a 51-050 (Cu-b1)

       

 Copper

 99.9% min (incl. Ag)    
 Phos  .04% to .06% Sulfur <0.0010%
Lead 0.0002% Antimony   0.0001%
Zinc 0.0001% Arsenic   0.0002%
Nickel 0.0002% Silver <0.0010%
Iron 0.0004% Tin   0.0002%

* The phosphorus content of this material deviates the above standards

Grain Size:

Average grain size: .120mm

Maximum Grain Size: .150mm

Test Method: ASTM E-112